* For surface mounted applications
* Low profile package
* Glass Passivated Chip Juntion
* Easy to pick and place
* Available in SMAF Package ORDERIN.

* Low profile package
* Glass Passivated Chip Juntion
* Easy to pick and place
* Available in SMAF Packa.

The S3AF~S3MF are available in SMAF Package FEATURES
* For surface mounted applications
* Low profile package
* Glass Passivated Chip Juntion
* Easy to pick and place
* Available in SMAF Package ORDERING INFORMATION Package Typ.

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